Our Services and Technology

25 YEARS of experience in manufacturing modern electronic modules for complete systems made us a reliable partner for various industries, from consumer electronics through mobile and automotive technology to the Hi-Tech IT / T industry.
We have certified Quality Management Systems according to IATF 16949 and ISO 9001, Environmental Management Systems according to ISO 14001, OSH Management System according to ISO 45001.

Production facilities

Our Production facilities

SMT assembling

average capacity 34,000 components per hour, under maximum load all lines 138,000 components per hour
various components assembling from size 0201, finepitch, μfinepitch, BGA, μBGA
3-shifts working avaliable
1 assembly lines equipped with SIEMENS Siplace (S20, F4)
3 assembly lines equipped with PANASONIC (MSR, MPA)
2 assembly lines equipped with PANASONIC (MSH2, MV2F)
reflow owens ERSA Hotflow 7, 9 > 7-9 zones owens and SIEMENS ReHm V8 Nitro

THT Assembling

3 conveyer manual assembly lines
3 automated soldering machines, Pb + Pb Free (2xATF, 1x SEHO)
ATF soldering using a nitrogen atmosphere
1x selective soldering (Inter Select)
3-shifts working available

Laser (engraving and labelling)

TRUMPF VectorMark VW800R

Automatic varnishing machine

NORDSON C708

Capability range

Parts shaping and forming

Forming various shapes lead components with usage of automated shaping machines
Cutting the length of the lead components
Assembling flat cables, crimping etc.

Heat-sink assemblies

Various type of heat-sink assemblies mounting with heatconducting paste
Components screwing and bonding with precision screwdrivers
Checking of the tightening torques
Fixing screws against loosening

AOI – automatic optical inspection

Guarantee of 100% optical check of correctness and accuracy of automatic components

Thru-hole components assembling

Assembling of large and sophisticated electronic systems under attendance of our skilled specialists
Manual soldering of difficult components

SMD assembling

Using curing process (glue dispensing + curing owen)
Using reflow process (solder paste + reflow owen)

Wave soldering

Automatic wave soldering technology under nitrogene
Guarantee of unleaded soldering technology (RoHS)
Specific shape products soldering using solder frames and solder masks

Functional and ICT testing

Preparation and design of testing devices and units based on output parameters of device and test requirements
Usage of dedicated and universal testing devices
Own development department of testing devices
IC test products through needle field at device TR5001T and IC Test by "flying needle" at device SPEA
Wide scale of functional tests by customer needs
High voltage tests of single components
Burn-in tests
System of tracebility, which guarantee execution of all demanded tests with logfile records

Special Technologies and services

Varnishing

Automatic varnishing application on PCB for purpose of protection against the air humidity using automatic varnishing machine
Hardening and drying varnishing masks

Potting

Automatic soaking of PCBA in plastic or metal housing using epoxide or resin based substances
Guarantee of exact automatic batching by devices with laser sensors

Special SMT technologies and processes

Washing PCB´s in special full automatic mashine Injet® 388-MCD
storage of MSL material in nitrogen atmosphere in 5% humidity - device ASVS 1200M
drying components in special drying owen
mixing of solder paste in GLICHN device
system of tracebility via wireless server
dividing of PCB´s at JOT device
lead or lead free soldering

Special SMT technologies and processes